| 摘要 |
PROBLEM TO BE SOLVED: To provide device and method for reproducing grinding, which are capable of easily carrying out a technique for reproducing a wafer designed and processed with a circuit as a bare wafer or a solar cell wafer. SOLUTION: The grinding machine is equipped with a vacuum chuck 13 to which a wafer 12 to be ground is attached, a table turning device 3 for turning the vacuum chuck, a grinding stone 17 for grinding the wafer to be ground on the vacuum chuck, a Z-axis directional position controller for controlling the position in the Z-axis direction of the grinding stone, a horizontal position controller for controlling the position in the Y-axis direction of the grinding stone, a splash cover 8 for protecting the splash of grinding liquid generated from the wafer 12 to be ground, a frame 9 for supporting these devices and casters 11 attached to the bottom of the frame. COPYRIGHT: (C)2008,JPO&INPIT
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