发明名称 |
Method of manufacturing a semiconductor device |
摘要 |
The present invention is related to a method of producing a semiconductor device and the resulting device. The method is suitable in the first place for producing high power devices, such as High Electron Mobility Transistors (HEMT), in particular HEMT-devices with multiples source-gate-drain groups or multiple base bipolar transistors. According to the method, the interconnect between e.g. the source contacts (5,6) is not produced by air bridge structures, but by etching vias (11) through the semiconductor layer (2) directly to the ohmic contacts and applying a contact layer (13) on the backside of the device. |
申请公布号 |
EP1693891(A3) |
申请公布日期 |
2008.03.05 |
申请号 |
EP20060447017 |
申请日期 |
2006.01.31 |
申请人 |
INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM (IMEC) |
发明人 |
DAS, JOHAN;RUYTHOOREN, WOUTER |
分类号 |
H01L21/68;H01L21/768;H01L23/373 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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