| 摘要 |
A substrate processing apparatus is provided for processing a substrate (W) to be processed by supplying a process liquid from a process nozzle (50a) arranged above the substrate. The substrate processing apparatus can eliminate unintended liquid drops from the process nozzle. The substrate processing apparatus (20) is provided with the process nozzle (50a) for supplying the substrate with the process liquid; an arm (54) for supporting the process nozzle; and liquid drop removing nozzles (60, 62) for blowing gas to the process nozzle. An arm can move between a process position where the process nozzle is arranged above the substrate, and a standby position where the process nozzle is arranged outside the substrate. The drop removing nozzle is arranged in the vicinity of the process nozzle when the arm is at the standby position. ® KIPO & WIPO 2008
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