| 摘要 |
<p>The invention provides a hardening device with a semiconductor laser oscillator. The laser hardening device 1 has a table 20 rotating around axis C on a bed 10. A hardening head 40 that moves along axis Z is attached to a column 30 moving along axis Y orthogonal to axis C. The hardening head 40 has a semiconductor laser oscillator. A main spindle 50 of the hardening head rotates around axis B, and a laser beam is irradiated from a torch T to subject the surface of a work gripped via a chuck 22 on the table 20 to hardening. A torch automatic changer 100 has a plurality of torches T stored to the outer circumference portion of a rotating magazine, and automatically changes torches on the main spindle 50.</p> |
