发明名称 APPARATUS FOR INSPECTING WAFER
摘要 An apparatus for inspecting a wafer is provided to control the tilting phenomenon of a probe card and the twist of a probe needle by securing evenness of the wafer on the probe needle through exact control of a robot for a multi-shaft compensation. A probe card(40) is fixed on a probe station header(20). Plural probe needles are received in the probe card so that the probe card is electrically contacted to the wafer. A photographing unit is transferred in X- and Y-directions by a driving unit to scan a plane image of the wafer and a plane image of the probe needle. The wafer is mounted on a robot for a multi-shaft compensation. The robot for a multi-shaft compensation compensates a position of the wafer so that the probe needle and the wafer are parallel according to the plane image information scanned by the photographing unit. The robot for a multi-shaft compensation includes a fixing plate(210), plural legs(220), and a head plate(230).
申请公布号 KR100809600(B1) 申请公布日期 2008.03.04
申请号 KR20070011616 申请日期 2007.02.05
申请人 NEW CENTURY CO., LTD. 发明人 LEE, JUNG IL
分类号 H01L21/66 主分类号 H01L21/66
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