摘要 |
An apparatus for inspecting a wafer is provided to control the tilting phenomenon of a probe card and the twist of a probe needle by securing evenness of the wafer on the probe needle through exact control of a robot for a multi-shaft compensation. A probe card(40) is fixed on a probe station header(20). Plural probe needles are received in the probe card so that the probe card is electrically contacted to the wafer. A photographing unit is transferred in X- and Y-directions by a driving unit to scan a plane image of the wafer and a plane image of the probe needle. The wafer is mounted on a robot for a multi-shaft compensation. The robot for a multi-shaft compensation compensates a position of the wafer so that the probe needle and the wafer are parallel according to the plane image information scanned by the photographing unit. The robot for a multi-shaft compensation includes a fixing plate(210), plural legs(220), and a head plate(230).
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