| 摘要 |
A method includes placing a circuit board on a test sheet so that conductive pins on an underside of the circuit board are in electrically conductive contact with electrically conductive contact pads on an upper surface of the test sheet. The test sheet includes connectors at a periphery of the test sheet. The connectors couple the test sheet to test signal generating devices. The method further includes applying test signals to the circuit board via the test sheet. Other embodiments are described and claimed.
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