An apparatus for automatically measuring release force of an epoxy molding compound for a semiconductor package manufacture is provided to measure a difference between molds at a same temperature and under a same epoxy molding compound by installing various test molds on a single chase. A plurality of test molds(12) are constantly arranged and installed on a bottom of a single chase(10). A bottom mold(24) is arranged on a lower of the single chase. A transfer device(18) is mounted in the bottom mold to pressurize and supply a molding resin to a cavity of the respective test molds. A gauge bar(22) includes an upper section formed as a circular fixing plate and a lower section having a circular bar shape. The upper section of the gauge bar is exposed to the outside through an upper surface of the single chase. The lower section of the gauge bar passes through the single chase to be placed on an upper surface of the cavity of the test mold. A release force measurement sensor(20) is attached to a bottom of the circular fixing plate configuring the upper section of the gauge bar.
