| 摘要 |
Disclosed is an electroless gold plating liquid for forming a gold plating film for wire bonding which is characterized by containing a gold cyanide compound and oxalic acid and/or a salt thereof, but not containing a foundation metal dissolution inhibitor. The gold cyanide compound is preferably contained in an amount of 0.5-10 g/L in terms of gold ion concentration, and the oxalic acid and/or a salt thereof is preferably contained in an amount of 5-50 g/L. Preferably, the electroless gold plating liquid also contains a masking agent for dissolved foundation metal, and the masking agent is preferably composed of ethylenediaminetetraacetic acid and/or a salt thereof. |
