发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having resistance to noble metal plating in a neutral to alkaline cyanide plating bath and excellent in resolution, adhesion and resist removability, a photosensitive resin laminate using the photosensitive resin composition, a method for forming a resist pattern on a substrate using the photosensitive resin laminate, and uses of the resist pattern. <P>SOLUTION: The photosensitive resin composition comprises (a) 20-90 mass% of a carboxyl group-containing binder, (b) 5-75 mass% of an addition polymerizable monomer having at least one terminal ethylenically unsaturated group and (c) 0.01-30 mass% of a photopolymerization initiator, wherein the carboxyl group-containing binder (a) comprises a specific copolymer and the photopolymerizable monomer (b) comprises a specific compound. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008039978(A) 申请公布日期 2008.02.21
申请号 JP20060211940 申请日期 2006.08.03
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 HIMEDA YUKARI
分类号 G03F7/033;G03F7/004;G03F7/027;H05K3/00;H05K3/06;H05K3/18 主分类号 G03F7/033
代理机构 代理人
主权项
地址