发明名称 |
HEAT-GENERATING RESIN SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat-generating resin substrate hardly causing separation or fracture of a transparent conductive film from a surface of the resin substrate, and capable of rapidly removing tarnish of the surface and snow attached thereto. <P>SOLUTION: This heat-generating resin substrate 1 is provided with: a transparent or translucent resin substrate 10; a transparent conductive film 23 formed on a surface of the resin substrate 10; a pair of electrodes 25 arranged at positions in contact with the transparent conductive film 23; and a power source 31 supplying power to the transparent conductive film 23 through the electrodes 25. Between the resin substrate 10 and the transparent conductive film 23, a buffer layer 21 absorbing thermal extension difference between both of them is formed. Thereby, even when the transparent conductive film 23 is heated at a high temperature increase rate, the separation of the transparent conductive film 23 from the surface of the resin substrate 10, and the fracture thereof is hardly caused. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008041343(A) |
申请公布日期 |
2008.02.21 |
申请号 |
JP20060211756 |
申请日期 |
2006.08.03 |
申请人 |
GEOMATEC CO LTD;TOHO SHEET &, FRAME CO LTD |
发明人 |
INAGAKI SUSUMU;KAMASHIKA TOMOKAZU;NAKAMURA TAKEYA;SATO IWAO;KITO TOMOAKI;SHIROGANE DAISUKE;SUGIYAMA KOICHI;URYU NORIYUKI;ISAKU TOMOKIYO |
分类号 |
H05B3/20;B60J1/00;B60S1/02;H05B3/00;H05B3/14;H05B3/26 |
主分类号 |
H05B3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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