| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce conductive noise of mainly 30 MHz or lower in a semiconductor power module. <P>SOLUTION: With respect to the semiconductor power module 2, a rectifying circuit 7 and an inverter circuit 8 are packaged integrally, while as in metal base plates 10a and 10b and cooling bodies 5a and 5b, is constituted separated. Furthermore, the cooling bodies 5a and 5b are connected via an impedance element 15 so that the conductive noise having a frequency, of especially 30 MHz or lower, can be reduced efficiently. <P>COPYRIGHT: (C)2008,JPO&INPIT |
