| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a very reliable interposer board in which the adhesion of a through-electrode to a wiring layer is excellent. SOLUTION: The interposer board manufacturing method comprises processes of forming a wiring forming conductive material layer 18(19) on, at least, one surface of the board main body of a silicon board where the through electrode is provided penetrating it through in a perpendicular direction, and then patterning the wiring forming conductive material layer 18(19) into a wiring layer with an electrode pad electrically connected to the through electrode. In the interposer board manufacturing method, degassing holes 22 are bored in the wiring forming conductive material layer 18(19). COPYRIGHT: (C)2008,JPO&INPIT
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