| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of inexpensively positively executing insulation between solder lands on which a component is mounted, and a manufacturing method of the printed wiring board. <P>SOLUTION: A resist film 17 is provided on a conductive wiring so that it covers a portion provided on another solder land 16 side in the peripheral edge portion of one solder land 16 and the center of the solder land 16 is exposed, and a silk layer 21 is provided so as to overlap on the resist film 17 covering the peripheral edge portion of the solder land 16. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
