发明名称 HEAT FUSING DEVICE AND HEAT RADIATING METHOD FOR THE SAME
摘要 A reflow soldering machine and a method of dissipating heat are provided to reduce process time by increasing cooling rate at a tip. A reflow soldering machine which solders a work piece by converting electricity to heat includes heat dissipation tubes(50a,50b) which are passing through the inner space of reflow soldering machine to dissipate heat, a driver(60) for circulating fluid in heat dissipation tubes, a power supply which delivers external power to the reflow soldering machine, a heat dissipation block(30) composed of a first block and a second block with slits to dissipate heat, a connecting bracket(37) at an edge of the heat dissipation block to transfer heat generated from power source, and a tip(38) connected to the connecting bracket to solder a work piece by applying heat to the work piece. The heat dissipation tubes are passing through the first block and the second block. A sensor(40) is installed to the reflow soldering machine to sense temperature at the tip and transmit the temperature signal to a controller to maintain constant temperature at the tip. A method of dissipating heat includes a step of soldering work piece by lowering the tip, a step of cooling the reflow soldering machine by circulating fluid in heat dissipation tubes, a step of raising the tip, and a step of stopping the driver.
申请公布号 KR100804266(B1) 申请公布日期 2008.02.18
申请号 KR20070019182 申请日期 2007.02.26
申请人 KOREA ELECTRIC TERMINAL CO., LTD. 发明人 KIM, CHANG DEOK;SUK, SANG SIK
分类号 B29C65/02;B29C65/18 主分类号 B29C65/02
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