| 摘要 |
PROBLEM TO BE SOLVED: To provide a plural patterning wiring substrate for making it possible to excellently obtain the wiring substrate in which the shapes of one principal plane and the other principal plane are different. SOLUTION: There is provided a plural patterning wiring substrate in which a plurality of wiring substrate regions 102 are vertically and horizontally arranged at the central portion of a mother substrate 101 constituted by laminating at least three insulating layers. The plural patterning wiring substrate comprises a cavity 103 in the interior in a thickness direction in the boundary of the wiring substrate region 102 of the mother substrate 101. A first dividing line 104 and a second dividing line 105 which are for dividing the mother substrate 101 into individual wiring substrate regions 102 are formed on one principal plane and the other principal plane of the mother substrate 101, in such a manner that each of the dividing lines is lapped over the cavity 103 in planar view. The first dividing line 104 and the second dividing line 105 are not lapped over each other in planar view, in at least one side of the wiring substrate region 102. COPYRIGHT: (C)2008,JPO&INPIT
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