发明名称 |
Method of classifying directional defects on an object and apparatus for performing the same |
摘要 |
In a method of classifying directional defects on an object straight lines are drawn from any defect among all defects on the object toward adjacent defects. At least three defects that are positioned within an allowable angle from the straight lines are classified as directional defects. Thus, only the directional defects among all the defects on the semiconductor substrate may be accurately classified after performing a chemical mechanical polishing (CMP) process, so that the CMP process may be effectively managed.
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申请公布号 |
US2008037857(A1) |
申请公布日期 |
2008.02.14 |
申请号 |
US20070739900 |
申请日期 |
2007.04.25 |
申请人 |
LIM YOUNG-KYU;LEE BYUNG-AM;PARK JE-KWON;KO JAE-KYUN;LEE KYU;PARK KYOUNG-HEE |
发明人 |
LIM YOUNG-KYU;LEE BYUNG-AM;PARK JE-KWON;KO JAE-KYUN;LEE KYU;PARK KYOUNG-HEE |
分类号 |
G06K9/00 |
主分类号 |
G06K9/00 |
代理机构 |
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代理人 |
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