| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board for reducing a transmission loss in a high-frequency region, and to provide a manufacturing method for the circuit board. <P>SOLUTION: The circuit board 1 has opposed ground layer 14 and power supply layer 13, a wiring layer 10 fitted between the ground layer 14 and the power supply layer 13, and an insulator 12 formed between the ground layer 14 and the power supply layer 13 so as to hold the wiring layer 10. In the circuit board 1, a low dielectric-loss layer 11 having a dielectric tangent lower than the insulator 12 is formed on at least the top face or underside of the wiring layer 10. According to the circuit board 1, the transmission loss in the high-frequency region is reduced because the low dielectric-loss layer 11 is formed on an interface between the insulator 12 and the wiring layer 10. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
