| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which can give an adhesive giving a good coated surface without being subjected to viscosity adjustment with an organic solvent, effecting adherend bonding in such a manner that it temporarily bonds the adherends together by ultraviolet irradiation to allow their positioning and peeling, and finally increasing in adhesiveness at normal or elevated temperature to tightly bond the adherends together. <P>SOLUTION: The curable resin composition for an adhesive comprises an isocyanate-containing urethane (meth)acrylate (A) obtained by reacting a diol compound (a1) of a molecular weight of 1,000-7,000, a polyisocyanate compound (a2), and a hydroxyl-containing (meth)acrylate compound (a3), an ethylenically unsaturated compound (B), and a photopolymerization initiator (C). <P>COPYRIGHT: (C)2008,JPO&INPIT |
