SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR WAFER PROBE INSPECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method capable of reducing occurrence of burr caused by a gap of a metal generated in a pad at dicing, and executing probe inspection via a process controlling monitor without problems. SOLUTION: When probe inspection is executed for a manufacturing process of a semiconductor chip via a process controlling monitor; a pad 5 used as an electrode of the process controlling monitor is laminated by a plurality of wiring layers 7, each wiring layer 7 is connected by via holes 6 to increase the adherence strength of each wiring layer 7, and then, dicing is carried out so that the via holes 6 are left. COPYRIGHT: (C)2008,JPO&INPIT