| 发明名称 |
Heat-conductive silicone composition |
| 摘要 |
A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity. |
| 申请公布号 |
US7329706(B2) |
申请公布日期 |
2008.02.12 |
| 申请号 |
US20040476998 |
申请日期 |
2004.08.16 |
| 申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
FUKUI HIROSHI;SUTOH MANABU;ENAMI HIROJI;ONISHI MASAYUKI;OKAWA TADASHI;ONODERA SATOSHI |
| 分类号 |
C08L83/05;C08K3/22;C08K9/06;C08L83/04;C08L83/14 |
主分类号 |
C08L83/05 |
| 代理机构 |
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