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发明名称
蚀刻液喷射装置及蚀刻方法
摘要
本发明涉及一种用于对水平放置基板蚀刻之蚀刻液喷射装置及一种蚀刻方法。该蚀刻液喷射装置包括复数根喷管、复数个安装于该喷管上之喷嘴及增压装置,该增压装置增加该喷管中之喷射压力使得用于向待蚀刻基板部分喷射蚀刻液之喷嘴喷射压力高于向待蚀刻基板边缘部分喷射蚀刻液之喷嘴之喷射压力。该蚀刻液喷射装置可克服水坑效应,从而可提基板之蚀刻均匀性,进而提高基板之蚀刻精度。
申请公布号
TW200806809
申请公布日期
2008.02.01
申请号
TW095127753
申请日期
2006.07.28
申请人
鸿胜科技股份有限公司
发明人
李文钦;林承贤
分类号
C23F1/08(2006.01);H01L21/306(2006.01)
主分类号
C23F1/08(2006.01)
代理机构
代理人
主权项
地址
桃园县大园乡三和路28巷6号
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