| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an LSI package with an interface module which can correspond to miniaturization, which has high material utilization efficiency, in which floating metal does not exist between electric connection terminals, and which has an excellent high frequency characteristic. <P>SOLUTION: An LSI package with an interface module comprises an interposer 10 carrying a signal processing LSI11, and having a connecting electric terminal 14 for a mounting board on a rear surface side and a first electric connection terminal 17 on a front surface side; and an interface module 20 on which a transmission line 21 for a high-speed signal for wiring with an external apparatus is provided, and which has a second electric terminal 26 on a rear surface side and is to be electrically connected with the interposer 10 by mechanical contact between the first and second electric connection terminals 17 and 26, in a state in which the interposer 10 is mounted on a mounting substrate. At least one of the first and second electric connection terminals 17 and 26 comprises a conductive rubber bump. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
