| 摘要 |
A Bernoulli wand for transporting thin (e.g., 200 mm) semiconductor wafers between a rack and a hot process chamber. The wand has a head portion that is configured to cover the entire wafer. The head has a plurality of gas outlets configured to produce a flow of gas along an upper surface of a wafer to create a pressure differential between the upper surface of the wafer and the lower surface of the wafer. The pressure differential generates a lift force that supports the wafer below the head portion of the wand in a substantially non-contacting manner, employing the Bernoulli principle.
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