发明名称 |
Halbleiterbauelement mit elektromagnetischer Abschirmvorrichtung |
摘要 |
A semiconductor element comprises a semiconductor chip (2) with an integrated circuit having bond pads in a chip carrier (6) housing (5) with external connections and at least one ground connection (13). These are sheathed in an electrically isolating passivation (8) and by a grounded electrically and thermally conductive plastic housing. |
申请公布号 |
DE10332009(B4) |
申请公布日期 |
2008.01.31 |
申请号 |
DE2003132009 |
申请日期 |
2003.07.14 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BAUER, MICHAEL;WOERNER, HOLGER;ERNST, GEORG;STEINER, RAINER;BIRZER, CHRISTIAN;VILSMEIER, HERMANN |
分类号 |
H01L23/18;H01L23/29;H01L23/49;H01L23/552 |
主分类号 |
H01L23/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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