TOP RING HEAD WITH AIR TUBE IN CHEMICAL MECHANICAL PLANARIZATION

摘要

A top ring head with an air tube in a chemical mechanical planarization apparatus is provided to reduce difference in polishing level between a central portion and an edge of a wafer by controlling each pressure of circular air tube on a lower side of the top ring head. A top ring head in a chemical mechanical planarization apparatus comprises a plurality of circular air tubes(20). The air tubes having different diameters are mounted on a lower side of the top ring head which makes contact with a wafer, and are pressure-controlled individually in radial direction from the center of the top ring head in regular intervals.