| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To electrically bond a semiconductor chip over regions where heights in whole surfaces are different even if there are any height variations in the whole surfaces of a package, in a semiconductor device constituted by electrically bonding both electrodes of the semiconductor chip and a ceramic package in the state where sides having each electrode of the semiconductor chip and the ceramic package are made to be faced. <P>SOLUTION: Between a chip electrode 12 and a package electrode 22, there intervenes conductive adhesive 30 as a conductive bonding member which can be deformed at the time of loading a semiconductor chip 10 on a package 20. While the both electrodes 12, 22 are electrically connected by this conductive adhesive 30, heights variations T existing in whole surfaces 21 of the package 20 are absorbed by deforming the conductive adhesive 30. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
