发明名称 THERMOELECTRIC PACKAGE
摘要 PROBLEM TO BE SOLVED: To inexpensively provide a thermoelectric package capable of improving thermoelectric performance. SOLUTION: The thermoelectric package 10 includes an electronic component 21 serving as a heating element, and a thermoelectric module 30 capable of cooling the component 21. The electronic component 21 and the thermoelectric module 30 are stored in an airtight vessel 11. The vessel 11 is filled with carbon dioxide with a higher concentration than that of the carbon dioxide included in the air. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008021720(A) 申请公布日期 2008.01.31
申请号 JP20060190326 申请日期 2006.07.11
申请人 YAMAHA CORP 发明人 KANEKO AKIRA
分类号 H01L23/20;H01L23/38;H01L35/30 主分类号 H01L23/20
代理机构 代理人
主权项
地址