发明名称 |
Epoxy Resin, Epoxy Resin Composition And Cured Product Thereof |
摘要 |
The present invention relates to an epoxy resin whose cured product has a high heat resistance, and directed to provide an epoxy resin improved in adhesiveness and toughness in comparison with the conventional highly heat resistant epoxy resin. Specifically disclosed is an epoxy resin obtainable by glycidylation of a mixture of (a) a phenol compound condensate which is a condensate of phenols and glyoxal and contains not less than 80% (area % by a gel permeation chromatography) of a compound represented by the formula (1): (wherein R represents each independently a hydrogen atom, (C<SUB>1</SUB>-C<SUB>15</SUB>) hydrocarbon group or trifluoromethyl group); and (b) a phenol compound other than (a) or a phenol resin.
|
申请公布号 |
US2008021173(A1) |
申请公布日期 |
2008.01.24 |
申请号 |
US20050629313 |
申请日期 |
2005.06.24 |
申请人 |
NAKANISHI MASATAKA;AKATSUKA YASUMASA;OSHIMI KATSUHIKO;TANAKA RYUTARO |
发明人 |
NAKANISHI MASATAKA;AKATSUKA YASUMASA;OSHIMI KATSUHIKO;TANAKA RYUTARO |
分类号 |
C08G59/32;C08G65/48 |
主分类号 |
C08G59/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|