| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin usable for an encapsulant for a densified semiconductor element, a flexible board, a laminated board, a multi-layer board or the like, an adhesive material, an insulation-protecting material, etc., and providing a cured product simultaneously exhibiting excellent heat resistance, fractional toughness, water absorption and dielectric constant characteristics. SOLUTION: The method for producing the epoxy resin involves epoxidizing 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane in the presence of a nonprotonic polar solvent. The epoxy resin, and the epoxy resin composition containing the epoxy resin and an epoxy resin-curing agent are also provided. The epoxy resin is useful for the semiconductor encapsulant, the flexible wiring board or the laminated board. COPYRIGHT: (C)2008,JPO&INPIT
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