| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is suitable for single packaging, high in performance, and adapted to a various kinds of power supply devices. <P>SOLUTION: First, second and third semiconductor chips are mounted to a single package. The first and the second semiconductor chips are first and second power output MOSFETs. The third semiconductor chip includes: a drive circuit which drives the power MOSFETs; a control circuit which generates a switching control signal so as to obtain an output voltage of a desired voltage, and transmits it to the drive circuit; a first power supply circuit which generates a first internal voltage necessary for the operation of the drive circuit; and a second power supply circuit which generates a second internal voltage necessary for the operation of the control circuit. The first power MOSFET generates a current flowing to an inductor from an input voltage of a first power supply terminal, and the first and the second power supply circuits step down the input voltages; and generate the first and second internal voltages. <P>COPYRIGHT: (C)2008,JPO&INPIT |
