| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of semiconductor device capable of forming uniform joint and improved in the degree of freedom for selecting the thickness of solder, which becomes a factor for increasing the inclination of a semiconductor element while permitting the thickening of the solder, thereby improving the long period reliability of the semiconductor device. <P>SOLUTION: The semiconductor device is provided with the semiconductor element 5, a bed 7 for mounting the semiconductor element, external terminals connected electrically to the electrode of the semiconductor element, conductor straps for connecting electrically the electrode of semiconductor element to the external terminals and a resin sealing body for the resin sealing of these components. The manufacturing method comprises a process for the ultrasonic connection of the conductor strap 6 onto the semiconductor element 5, and a process for mounting the semiconductor element on the bed 7 after connecting the conductor strap 6 to the semiconductor element 5. The uniform joint can be formed and the degree of freedom of selecting the thickness of solder which becomes the factor for increasing the inclination of the semiconductor element is improved whereby the thickness of solder can be increased, thereby permitting the improvement of long period reliability of the semiconductor device. <P>COPYRIGHT: (C)2008,JPO&INPIT |
