| 摘要 |
The invention discloses a forming method including the steps of: (1) providing a nonconductor; (2) vacuum-sputtering a first metal layer onto the nonconductor; (3) plating an outer metal layer onto the first metal layer, wherein the material of the outer metal layer is different from that of the first metal layer. The invention also discloses a model including a first metal layer formed by a vacuum-sputtering process and an outer metal layer plated onto the first metal layer. The forming method of the invention involves vacuum-sputtering a metal layer onto the nonconductor, such that the surface quality is better. Consequently, the surface quality of other materials plated onto the metal layer will also be better. Furthermore, the method of the invention is simple to operate and will not pollute the environment. |
