| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device including a semiconductor chip provided with a diaphragm detecting pressure variation by vibration. SOLUTION: The semiconductor device 1 includes the semiconductor chip 7; a plate shaped arrangement board 3 for fixing the semiconductor chip 7 by disposing the diaphragm 23 opposite a surface 3a; a resin-sealing part 11 for sealing the periphery of the semiconductor chip 7 and the surface 3a of the arrangement board 3; an annular dam member 13 projecting above the semiconductor chip 7 so as to encompass the outside of the diaphragm 23; and a plate-shaped lid member 15, including an opening part 15a through a thickness direction, fixed to a tip part of the dam member 13, and covering a part above the semiconductor chip 7. The resin-sealing part 11, the dam member 13, and the lid member 15 form a hollow cavity part S2, where the diaphragm 23 exposes, and the hollow cavity part S2 communicates with the outside via the opening part 15a. COPYRIGHT: (C)2008,JPO&INPIT
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