发明名称 |
Stacked microelectronic layer and module with three-axis channel T-connects |
摘要 |
<p>A method for interconnecting stacked layers containing integrated circuit die and a device built from the method is disclosed. The stacked layers are bonded together to form a module whereby individual I/O pads of the integrated circuit die are rerouted to at least one edge of the module. The rerouted leads terminate at the edge. Channels are formed in a surface of the module or on the surface of a layer whereby the rerouted leads are disposed within the channel. The entire surface of the edge or layer is metalized and a predetermined portion of the metalization removed such that the rerouted leads within each channel are electrically connected to each other.
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申请公布号 |
EP1693892(A3) |
申请公布日期 |
2008.01.23 |
申请号 |
EP20050111589 |
申请日期 |
2005.12.01 |
申请人 |
IRVINE SENSORS CORPORATION |
发明人 |
GANN, KEITH;BOYD, W. ERIC |
分类号 |
H01L21/98;H01L25/065 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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