PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

摘要

A printed circuit board and a method for manufacturing the same are provided to improve a performance of the printed circuit board having a high density since the area of an interface between a land and a paste bump becomes larger. A method for manufacturing a printed circuit board includes the steps of: forming a circuit pattern including a land on a surface of a first substrate(S100); forming a paste bump on the land of the first substrate(S200); and stacking an insulation material on the surface of the first substrate such that the paste bump passes through the insulation material, wherein the paste bump is formed to cover the land of the first substrate(S300). The method for manufacturing the printed circuit board further includes the step of stacking a second substrate formed with the circuit pattern having the land on the surface of the second substrate(S400), wherein the paste bump passing through the insulation material covers a land of the second substrate.