POLISHING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE POLISHING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURED BY THE MANUFACTURING METHOD

摘要

The present invention provides a polishing apparatus with a construction which makes it possible to prevent the peripheral portions of a substrate from sloping downward as a result of the polishing member tilting at the peripheral portions of the substrate during the polishing of the substrate, and which makes it possible to adjust the contact pressure quickly in accordance with changes in the contact area between the polishing surface and the substrate surface.