发明名称 |
METHOD FOR FORMING SURFACE GRAFT, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING METAL PATTERN, METHOD FOR FORMING MULTILAYER WIRING BOARD, SURFACE GRAFT MATERIAL, AND CONDUCTIVE MATERIAL |
摘要 |
<p>The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.</p> |
申请公布号 |
KR100796248(B1) |
申请公布日期 |
2008.01.21 |
申请号 |
KR20067021974 |
申请日期 |
2006.10.23 |
申请人 |
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发明人 |
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分类号 |
C08J7/16;B32B27/34;C08J5/22;C08J7/18;C23C18/16;C23C18/20;C23C18/28;C25D5/34;H05K3/00;H05K3/06;H05K3/38;H05K3/46 |
主分类号 |
C08J7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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