| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Zn type copper alloy having high strength and excellent bendability for use in electronic parts such as terminals and connectors. SOLUTION: The Cu-Zn alloy with high strength and excellent bendability is characterized in that it has a composition consisting of 20 to 40 mass% Zn and the balance Cu with inevitable impurities, in that it has such crystal grain characteristics that mean grain size (mGS) ranges from 1 to 4μm and the standard deviation of the grain size, (σGS) is≤1/3 mGS, and in that the relational expression of X-ray diffraction intensities from rolling surface, äI(220)+I(111)}/I(200)=2.0 to 5.0 is satisfied. The alloy can further contain 0.01 to 0.3 mass% of one or more elements among Ni, Si, Fe, Ti, Co and Sn, and it is preferable that S content is≤30 ppm and surface roughness Ra is≤0.2μm. COPYRIGHT: (C)2008,JPO&INPIT
|
