| 摘要 |
PROBLEM TO BE SOLVED: To provide a primer composition for electroless plating capable of forming a plating film superior in adhesion on a non-conductive base material with a smooth surface by an electroless plating without lowering its smoothness, without applying a roughening process to the surface of the base material or adding a process for giving roughness by further providing a receiving layer on the surface of the base material. SOLUTION: The primer composition for electroless plating contains metal colloidal particles, a hardening composition hardenable at a temperature of 120°C or lower and a solvent. COPYRIGHT: (C)2008,JPO&INPIT
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