| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can correctly position a wafer without using acceptable chips. <P>SOLUTION: This method has a step of positioning the wafer 11 by selecting chips 15b-15d existing on the external circumference of the wafer 11 having the chips 15a-15d formed thereon, recognizing an omission state of a plurality of portions in the selected chips 15b-15d, and comparing a result of comparison with a set value; and a step of picking up the chips on the wafer 11 after positioning the wafer 11. <P>COPYRIGHT: (C)2008,JPO&INPIT |
