发明名称 MOLD CLAMPING FORCE SETTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping force setting method capable of accurately setting an appropriate mold clamping force without using a mold positioning sensor. SOLUTION: A mold clamping force with a prescribed intensity is applied on a mold 11 by a mold clamping apparatus 10, and changing in the detected value of the mold clamping force is detected by a mold clamping force sensor 18 while filling a resin into the mold 11. Based on the change detected, the value of the mold clamping force to be applied to the mold 11 is set. The value of the mold clamping force with the prescribed intensity is made the maximum value of the mold clamping force which can be generated by the mold clamping apparatus 10, and when the change in the value of the mold clamping force is not detected, while gradually decreasing the value of the mold clamping force with the prescribed intensity, the change in the value of the mold clamping force is repeatedly detected. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008006651(A) 申请公布日期 2008.01.17
申请号 JP20060178472 申请日期 2006.06.28
申请人 SUMITOMO HEAVY IND LTD 发明人 MOTOMURA TAKASHI
分类号 B29C45/64;B29C45/76 主分类号 B29C45/64
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