| 摘要 |
PROBLEM TO BE SOLVED: To relax thermal stress of a thermoelectric conversion device securing conductivity and thermal conductivity of the thermoelectric conversion device. SOLUTION: The thermoelectric conversion device comprises at least a pair of first semicondutor element and a second semiconductor element juxterposed between facing two heat exchange substrates, and having mutually different polarities; an elastic electric plate interposed between the one heat exchange substrate that is a high temperature side of the foregoing two heat exchange substrates and the first and second semiconductor elements, and between the other heat exchange substrate that is a low temperature side of the two heat exchange substrates and the foregoing first and second semiconductor elements for alternately serially connecting the fist and second semiconductor elements; a bar member disposed between the one heat exchanger and the other heat exchanger for supporting the one and the other heat exchange substrates; and a pressure contact member coupled with both ends of the bar member from the outside of the one and the other heat exchange substrates to make pressure contact between the first and second semiconductor elements and the electrode plate. COPYRIGHT: (C)2008,JPO&INPIT
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