发明名称 |
Thermally distributed integrated power amplifier module |
摘要 |
An integrated power amplifier (PA) module formed on a substrate includes a first cluster of transistor cells positioned in a first portion of the substrate; a second cluster of transistor cells positioned in a second portion of the substrate and spaced apart from the first portion; and a combiner coupled to the first and second clusters to combine the output of the first and second clusters.
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申请公布号 |
US2008012645(A1) |
申请公布日期 |
2008.01.17 |
申请号 |
US20060486465 |
申请日期 |
2006.07.14 |
申请人 |
MICRO-MOBIO |
发明人 |
ICHITSUBO IKUROH;KUWANO MASAYA;MATSUMOTO KOSHIRO |
分类号 |
H03F3/14 |
主分类号 |
H03F3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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