| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is mounted while being combined with an existing semiconductor device by properly selecting the existing semiconductor device in addition to an exclusive semiconductor device when stackingly mounting the semiconductor devices. SOLUTION: The semiconductor device is used when a plurality of the semiconductor devices 11, 12 are stackingly mounted on a mounting substrate. The semiconductor devices 11, 12 are respectively mounted onto one face and the other face of an interposer substrate 30. The interposer substrate 30 is electrically connected with a mounting common substrate 40 that supports the interposer substrate 30 mounted with the semiconductor devices 11, 12. COPYRIGHT: (C)2008,JPO&INPIT
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