WAFER LEVEL PACKAGED DEVICES AND THE FABRICATION METHOD

摘要

A wafer level-packaged device and a manufacturing method thereof are provided to decrease a chip-bonding time by bonding a second chip wafer with a first chip wafer on a wafer level. A wafer level-packaged device includes a first wafer(210) of a first chip(211) which is bonded with a wafer(220) of a second chip(221). The wafer of the second chip includes a groove which selectively penetrates the wafer. A probe is inserted into the groove which is formed on the wafer of the second chip, such that an electrical property of the semiconductor device is checked. The wafers of the first and second chips which are arranged to be symmetrical with respect to each other with the groove between them, are sawn at the same time. The sawn semiconductor device is electrically connected to a substrate.