| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering apparatus in which a motor is provided on an upper part of a solder tank, rotating blades are provided in a duct provided in the solder tank and extending in the flow direction in a method for preventing oxidation of a solder generated from a drive shaft part for rotating the rotating blades to eject the solder from an ejection hole in a molten solder tank for the flow soldering, the rotating blades are connected via the drive shaft, and a problem is solved in that the size of the solder tank is increased in order to provide related devices such as a drive shaft for rotating the rotating blades and a straightening vane below the ejection hole for preventing any irregular rotation of the rotating blades for ejecting the solder from the ejection hole or pulsation, etc. caused by the blades on a top face of the solder tank. SOLUTION: Rotating blades, a drive shaft connected to the rotating blades and a motor unit for rotating the drive shaft are provided below the solder level, and the drive shaft is penetrated while sealing a bottom plate of a solder tank. Any contact with air is eliminated to prevent oxidation of a solder generated from a drive shaft part. COPYRIGHT: (C)2008,JPO&INPIT |
