| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film for back surface grinding of a semiconductor wafer capable of preventing breakage and contamination of the wafer due to intrusion of water and grinding chips between a wafer surface and an adhesive layer in grinding a back surface of the semiconductor wafer, not breaking the wafer in peeling it and not causing contamination of the wafer surface and a back surface grinding method of the semiconductor wafer using it. <P>SOLUTION: This adhesive film for back surface grinding has the adhesive layer formed by using coating liquid for the adhesive layer containing specific quantity of (1) an acrylic acid alkyl ester system adhesive polymer having a functional group reactive with a cross linking agent, (2) specific cross linking agent a main skeleton of which is an alkylene glycol polymer the number of carbon of an alkylene group of which is 2 to 4, having at least two pieces of glycidyl groups on its terminal and weight average molar weight of which is 1,000 to 5,000 and (3) other cross linking agents as essential components. Additionally, the back surface grinding method uses the adhesive film for back surface grinding. <P>COPYRIGHT: (C)2008,JPO&INPIT |
