发明名称 ELECTRICALLY CONDUCTIVE BASE MATERIAL FOR PLATING, METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CONDUCTOR LAYER PATTERN-FITTED BASE MATERIAL, CONDUCTOR LAYER PATTERN-FITTED BASE MATERIAL AND ELECTROMAGNETIC WAVE SHIELDING MEMBER USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electrically conductive base material for plating for producing a conductor layer pattern-fitted base material useful for an electromagnetic wave shielding member subjected to patterning so as to have electrical conductivity and light transmissivity using a transferring process with high productivity. SOLUTION: The electrically conductive base material for plating has a projecting part pattern and recessed parts with the shape of geometric figure drawn thereby. An insulation layer is formed on the surface of each recessed part at a position lower than the position lower by 0.5 to 3μm from the upper end of each projecting part, the width of the exposed part of each projecting part in the electrically conductive base material is 1 to 40μm, and the height of each projecting part after the application of the insulation layer to each recessed part is≥10μm. It is preferable that, as the exposed part of each projecting part progresses to the tip direction, the width is not widen, and, as the whole, the width is reduced at the upper part compared with the lower part. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008001952(A) 申请公布日期 2008.01.10
申请号 JP20060173721 申请日期 2006.06.23
申请人 HITACHI CHEM CO LTD 发明人 TOSAKA MINORU;UEHARA TOSHISHIGE;SUZUKI KYOSUKE;OKAMURA TOSHIRO
分类号 C25D1/10;C23F1/02;C25D1/08;C25D5/02;C25D7/00;G09F9/00;H05K9/00 主分类号 C25D1/10
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