Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same,申请号EP20010111661-传众专利搜索

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发明名称	Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same
摘要
申请公布号	EP1259102(B1)	申请公布日期	2008.01.09
申请号	EP20010111661	申请日期	2001.05.14
申请人	OKI PRINTED CIRCUITS CO., LTD.	发明人	IINAGA, HIROSHI
分类号	H05K3/46;H05K1/11	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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