| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device for improving the quality of a molded product and easily releasing the molded product from a molding die. SOLUTION: A resin sealing device is provided with a handler 1 carrying a base 3 on which semiconductor chips 2 are mounted while holding the base as it is and a molding die 7 on which the base 3 carried by the handler 1 is mounted and a resin sealing section 6 with an insert block 10 on which a molding recess 9 to be filled with a liquid resin 14 for resin sealing the semiconductor chips 2 is formed is provided on one mold. The base 3 being held by the handler 1 is mounted on the molding die 7, and while a semiconductor chip 2 is embedded in the molding recess 9 filled with the liquid resin 14, the molding recess 9 is heated with priority to cure the liquid 14 and carry out the resin sealing. |
